DSC版本核心板资料 / DSC version information

https://www.phytec.eu/products/soms-system-on-modules/phycore-dsc/

建议封装尺寸：

建议钢网厚度：0.1mm

定位柱的焊盘，锡膏层要做成下面图示的样子：

这个核心板是这个样子的：

侧边看的图：

核心板的PCB图片(背面)：

在焊接时，需要用到“预成型焊锡粒”（solder preform）。

如 http://www.asia-general.com/index.php?s=/en/product/preview/cid/51 

规格书：TDS-YTP203-预成型焊锡粒0402.doc

铟泰公司也有做这个：

http://indiumchina.cn/

是否可以重新贴？

DSC-connections cannot be reworked. The are two problems: At first you must heat the board to the melting temperature, but all solder joints are liquid and the risk to damage other solder joints ist very high. In most cases the pads pulled off, because the solder joints between the boards are liquid.

The second problem is that if the board wasn't destroyed while desoldering, it isn't possible to have a exact amount of solder on the modules after desoldering. So the risk of cold solder joints is high, because you cannot compensate the missing amount of solder with extra paste.